报告人：Dan Li，Xi’an Jiaotong University

　　报告时间：2023年5月10日 上午10:00

　　报告地点：瞬态室三楼会议室

　　邀请人：王斌浩 研究员

　　摘要：Thanks to the booming in optical communications and 3D sensing applications, Opto-Electronic IC (OEIC) has undergone tremendous development in recent years. In this talk, I will describe our work on OEIC design tailored to a myriad of optical communication scenarios ranging from Ethernet, Backbone network to mass volume access network, addressing their specific challenges and concerns. In addition, I will also introduce some of our recent work on TOF (Time-of-flight) Lidar sensor for consumer electronics and vehicle detection.

About the Speaker:

Dan Li received Ph.D. degree from University of Pavia, Pavia, Italy, in 2013. From 2007 to 2009 he was with Nvidia Shanghai R&D center, China, where he worked on custom SRAM circuitry. From 2011 to 2014 he was with Studio di Microelettronica, STMicroelectronics, Pavia, Italy, working on CMOS optical receiver for 100GBE optical link and silicon phonics applications. He joined School of Microelectronics, Xi’an Jiaotong University, Xi’an, China, in 2015, where he currently serves as a tenured associate professor. His current research interests include high-speed optical, 3D sensing and low power mixed-signal circuits. He has published papers on both electronics and optics, including IEEE JSSC, IEEE TCAS-I, IEEE TCAS-II, IEEE TPE, IEEE JLT, IEEE PTL, IEEE VLSI, IEEE MWCL, IEEE CICC, etc. He is a consulting expert of National Key R&D programs. He is a member of IEEE, and TPC member of IEEE ICTA.